Enhanced Thermally Conductive Compound for Power Electronics

With 7 times higher thermal conductivity and 10 times thermal diffusivity than other heat sink compounds and silicons, CoolMag™ allows minimizing hot spots in transients thanks to its high heat transfer at low temperature and fast stabilization.

The thermal gel will not depolymerize when heated in confined spaces. Fully AECQ 200 compliant. Negligible mass loss in at high temperature.

Excellent thermal shock, water-proof, and ageing resistance.

CoolMag™ resin has UL-94 V0 behaviour based on no halogenated flame retardant.

It’s very low hardness helps to absorb mechanical energy and dilatation, reducing breaking, chipping and cracking risks in power electronic systems such as ferrite cores and Li-Ion batteries expansion overheating.

Low viscosity product compared to other thermally conductive materials, easing the encapsulation process thus fully injectable and low pressure and room temperature. Simple degassing and fast die casting and potting by gravity or at low vacuum.

No special tools are needed to apply the resin. It’s easy to clean. It does not require high pressure nor high temperature to install. It can be used for die-casting by gravity (vacuum not mandatory) and while in liquid form, is easily moldable, and it is not sticky and easy to demould. The products can be cured at room temperature or quickly cured and relatively low temperature of polymerization thus making this heat sink for power electronics a clean, fast and simple solution.