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Long-term [1],reliable protection of sensitive electronic components is essential to many electronic applications today and prevents premature failure. Increasingly small systems and rising circuit densities have resulted in hotter operating temperatures, and driven demand for high-performance solutions for heat dissipation .   Methods of Embedding[2]  The following table shows the different technologies currently applied to …  

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Low surface energy materials Certain polymeric substrates are difficult to bond. The main reason that these materials present problems is their low surface energy which is unlike metals, ceramics, and most other polymers. The low surface energy simply prevents conventional adhesives from making intimate contact (wettability) with the substrate surface and this reduces adhesion. Image 1: a) Surface Free …  

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The non‐steady‐state or transient technique records a measurement during the heating process. The method determines thermal conductivity properties by means of transient sensors. These measurements can be made relatively quickly, which garners an advantage over steady‐state techniques. For this reason, numerous solutions have been derived for the transient heat conduction equation by …  

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TDS – COOLMAGPLAST – EN 0.1 New Thermally Conductive Compound, Coolmagplast TM   COOLMAGPLAST is a thermally conductive, electrically non-conductive PA6 based flame retardant grade. COOLMAGPLAST is lightweight, net-shape moldable and allows design freedom in applications previously restricted to metals and ceramics. COOLMAGPLAST combines thermal conductivity and electrical insulation in standard pellet form …  

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Thermal properties Heat flows across temperature differences. There are three modes of heat transfer: conduction, radiation, and convection. Conduction and radiation are fundamental physical mechanisms, while convection is really conduction as affected by fluid flow. Conduction is an exchange of energy by direct interaction between molecules of a substance containing temperature differences. …  

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Embedding processes of electronic devices Long-term [1],reliable protection of sensitive electronic components is essential to many electronic applications today and prevents premature failure. Increasingly small systems and rising circuit densities have resulted in hotter operating temperatures, and driven demand for high-performance solutions for heat dissipation. Potting process (1) Methods of Embedding[2] The …  

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