Control of temperature in power electronics

Temperature it is a  bottleneck for all power electronics in general, that’s a fact.

We need safer, more efficient, and reliable electronics but as we are taking power density values to the limits, thermal performance becomes a tricky topic.

Not only because thermal compounds have to fit all these technical requirements ( thermal & electrical properties, mechanical & chemical resistance, regulatory…) but also  manufacturability can make the difference and has crucial implications into the implementation and industrialization.

Making a few prototypes in the lab it’s an easy topic, but as forecasts increase to thousand units per week, meeting market deadlines it’s a challenge.

In the last months, our Lab Team has been working hard in order to improve flowability and reduce the viscosity of our entire range,  without compromising any of the other parameters (thermal/electrical properties).

That means better handling and manipulation, and no special tooling needed,  improving costs and productivity.

Unlike other potting products available on the market, encapsulation with Coolmag :

• No need to heat it up and no exothermic reactions occur.
• VOC free & Outgassing certification
• Fluidity and low viscosity
• Excel·lent thermal properties

Due to low viscosity value, potting using Coolmag is now easier than ever:

CoolMag™ Range is designed to provide thermal conductivity, electrical safety, hazard protection, mechanical and fire protection for electronic encapsulating applications. Just ask for a sample!